The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2013
Filed:
Jan. 31, 2012
William E. Bernier, Endwell, NY (US);
Marcus E. Interrante, New Paltz, NY (US);
Rajneesh Kumar, Poughkeepsie, NY (US);
Chenzhou Lian, Poughquag, NY (US);
Janak G. Patel, South Burlington, VT (US);
Peter Slota, Jr., Vestal, NY (US);
William E. Bernier, Endwell, NY (US);
Marcus E. Interrante, New Paltz, NY (US);
Rajneesh Kumar, Poughkeepsie, NY (US);
Chenzhou Lian, Poughquag, NY (US);
Janak G. Patel, South Burlington, VT (US);
Peter Slota, Jr., Vestal, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An array of solder balls is attached to solder pads of one of a first substrate and a second substrate. After aligning the array of solder balls relative to solder pads of the other of the first substrate and the second substrate, a thermal-mass-increasing fixture is placed on a surface of the second substrate to form an assembly of the first substrate, the second substrate, and the array of the solder balls therebetween, and the thermal-mass-increasing fixture. The thermal-mass-increasing fixture is in physical contact with at least a surface of a periphery of the second substrate. The thermal-mass-increasing fixture reduces the cool-down rate of peripheral solder balls after a reflow step, thereby increasing time for deformation of peripheral solder balls during the cool-down and reducing the mechanical stress on the solder balls after the cool-down.