The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2013
Filed:
Apr. 13, 2010
Hitoshi Takeuchi, Chiba, JP;
Keiji Sato, Chiba, JP;
Kiyoshi Aratake, Chiba, JP;
Masashi Numata, Chiba, JP;
Takahiko Nakamura, Chiba, JP;
Daisuke Terada, Chiba, JP;
Takeshi Sugiyama, Chiba, JP;
Hitoshi Takeuchi, Chiba, JP;
Keiji Sato, Chiba, JP;
Kiyoshi Aratake, Chiba, JP;
Masashi Numata, Chiba, JP;
Takahiko Nakamura, Chiba, JP;
Daisuke Terada, Chiba, JP;
Takeshi Sugiyama, Chiba, JP;
Seiko Instruments Inc., Chiba, JP;
Abstract
To provide an improved solderability for mounting an electronic component onto a circuit board, a package of an electronic component () is formed by bonding together a base () made of glass and a lid (). Outer electrodes () and () are formed on a bottom surface of the base (), and the outer electrodes () and () are respectively connected to through electrodes () and (). The outer electrodes () and () each have a laminated structure of three CrAu layers, that is, from a Cr layer (first layer) to an Au layer (sixth layer). When the outer electrodes () and () are soldered onto a circuit board, the Au layers as the second, fourth, and sixth layers are dissolved into solder, whereas the Cr layers as the third and fifth layers, which hardly form an intermetallic compound with solder, are separated to remain in solder.