The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2013

Filed:

Mar. 04, 2008
Applicant:

Koichiro Masuda, Tokyo, JP;

Inventor:

Koichiro Masuda, Tokyo, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/04 (2006.01); H01G 4/005 (2006.01); H01G 4/008 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
Abstract

A capacitive element that can efficiently reduce high-frequency noise generated in a circuit is provided. A capacitive elementincludes a capacitive formation portion, which is formed in the shape of a loop to separate the inside from the outside. The capacitive formation portionincludes an electrode, an opposite electrode, and a dielectric layer. One or more outgoing terminals (one or more outer circumference outgoing terminals, and one or more internal circumference outgoing terminals) are provided at the outer and inner circumferences of the electrode, respectively. A printed wiring board is made by mounting the capacitive element inside the board or on the surface of the board. A semiconductor package is made by putting the capacitive elementon a target semiconductor circuit portion. Moreover, a semiconductor circuit is made by placing the capacitive element on a target functional circuit portion


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