The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2013

Filed:

Dec. 03, 2010
Applicants:

Hua-li Zhou, Shenzhen, CN;

Ming Wei, Shenzhen, CN;

Chia-nan Pai, Taipei Hsien, TW;

Shou-kuo Hsu, Taipei Hsien, TW;

Inventors:

Hua-Li Zhou, Shenzhen, CN;

Ming Wei, Shenzhen, CN;

Chia-Nan Pai, Taipei Hsien, TW;

Shou-Kuo Hsu, Taipei Hsien, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 7/38 (2006.01);
U.S. Cl.
CPC ...
Abstract

A printed circuit board includes an insulation layer and a signal layer attached to the insulation layer. The signal layer includes a pair of differential transmission lines. Width W of each of the differential transmission lines is changed according to change of space S between the differential transmission lines, based on the following formula: In above formula, C1=7.475, C2=5.98, C3=0.48, C4=−0.96, H is a thickness of the insulation layer, Wis an original width of each of the differential transmission lines, and Sis an original space between the differential transmission lines, and T is a thickness of each of the differential transmission lines.


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