The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2013

Filed:

Oct. 24, 2008
Applicants:

Jonathan Michael Protz, Durham, NC (US);

Marc Stephen Verdiel, Chicago, IL (US);

David James Fields, Burke, VA (US);

Inventors:

Jonathan Michael Protz, Durham, NC (US);

Marc Stephen Verdiel, Chicago, IL (US);

David James Fields, Burke, VA (US);

Assignee:

Logos Technologies LLC, Fairfax, VA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 25/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention relates to the formation of a vacuum electronics circuit by the fusion bonding of multiple substrate wafers, e.g., silicon, copper, or other suitable conductive material, each etched using DRIE, cut using EDM, or machined by other suitable means. Other aspects of the invention relate to the alignment of a cathode with tube by fusion bonding the cathode wafer to a tube built using the fabrication methods described herein. Yet other aspects involve the alignment of dies or wafers during the fabrication of a vacuum electronics device using the 'lego' technique outlined herein. In yet other aspects, fabrication methods are described.


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