The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2013

Filed:

Feb. 01, 2008
Applicants:

Yukinari Harimoto, Hadano, JP;

Maki Itoh, Tokyo, JP;

Dimitris Elias Katsoulis, Midland, MI (US);

Inventors:

Yukinari Harimoto, Hadano, JP;

Maki Itoh, Tokyo, JP;

Dimitris Elias Katsoulis, Midland, MI (US);

Assignees:

Dow Corning Corporation, Midland, MI (US);

Dow Corning Toray Company, Ltd., Chiyoda-ku, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 77/12 (2006.01);
U.S. Cl.
CPC ...
Abstract

A curable liquid composition obtained by subjecting hydrogen halosiloxane or hydrogen alkoxysilane to condensation or to hydrolysis and condensation in an organic solvent in which fine polyvalent metal oxide particles with hydroxyl groups are dispersed; a method of forming a hard silica-type layer by applying onto an inorganic substrate the aforementioned composition and then curing the composition; an inorganic substrate with the aforementioned hard silica-type layer; and a semiconductor device comprising the aforementioned inorganic substrate on which a semiconductor layer is formed.


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