The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2013

Filed:

Apr. 16, 2010
Applicant:

Kanshi Chinone, Hitachi, JP;

Inventor:

Kanshi Chinone, Hitachi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24D 3/02 (2006.01); C09C 1/68 (2006.01); C09K 3/14 (2006.01); B02C 7/00 (2006.01); B01D 29/00 (2006.01); B01D 29/46 (2006.01); B01D 24/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A polishing slurry for semiconductor planarization containing cerium oxide particles and water, wherein the content of the cerium oxide particles having a diameter of 3 μm or more is 500 ppm or less (weight ratio) in a solid, preferably 100 ppm or less and it is more preferable that D99 (99% by volume of the whole particles in polishing slurry) of the cerium oxide particles is 1 μm or less. The polishing slurry can reduce the generation of scratches, and can polish a surface of the semiconductor substrate in the wiring formation process of semiconductor device precisely at a high speed.


Find Patent Forward Citations

Chinone, Kanshi. (2013). Abrasive compounds for semiconductor planarization (U.S. Patent No. 8439995). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8439995

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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