The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2013

Filed:

Aug. 30, 2010
Applicants:

Max W. Durney, San Francisco, CA (US);

Radha Vaidyanathan, Los Altos, CA (US);

Ryan Lam, San Mateo, CA (US);

Inventors:

Max W. Durney, San Francisco, CA (US);

Radha Vaidyanathan, Los Altos, CA (US);

Ryan Lam, San Mateo, CA (US);

Assignee:

Industrial Origami, Inc., Middleburg Heights, OH (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B21D 43/28 (2006.01);
U.S. Cl.
CPC ...
Abstract

A two-dimensional sheet material is provided that is suitable for bending along a bend line to form a three-dimensional object. The sheet material is provided with a plurality of displacements in a thickness direction of the sheet material on one side of the bend line. A portion of the displacements shear adjacent the bend line and define an edge and an opposed face. The edge and opposed face configured to produce edge-to-face engagement of the sheet material during bending. Alternatively, sheet material is provided with a plurality of displacements in a thickness direction of the sheet material on one or both sides of the bend line, and with a plurality of corresponding and cooperating protrusions to improve structural integrity and/or to improve electromagnetic and radio frequency shielding. The sheet material may also be provided with a self-latching structure. A method of preparing and using these sheet materials is also described.


Find Patent Forward Citations

Loading…