The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2013
Filed:
Jun. 13, 2008
Tadahiro Morifuji, Kyoto, JP;
Shigeyuki Ueda, Kyoto, JP;
Tadahiro Morifuji, Kyoto, JP;
Shigeyuki Ueda, Kyoto, JP;
Rohm Co., Ltd., Kyoto, JP;
Abstract
Disclosed is a semiconductor device suppressed in decrease of reliability. The semiconductor device comprises an electrode pad portion formed on the upper surface of a semiconductor substrate, a passivation layer so formed on the upper surface of the semiconductor substrate as to overlap a part of the electrode pad portion and having a first opening portion where the upper surface of the electrode pad portion is exposed, a barrier metal layer formed on the electrode pad portion, and a solder bump formed on the barrier metal layer. The barrier metal layer is formed such that an outer peripheral end lies within the first opening portion of the passivation layer when viewed in plan.