The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2013
Filed:
Mar. 16, 2009
Yoshiki Sota, Osaka, JP;
Kazuaki Tatsumi, Osaka, JP;
Yoshiki Sota, Osaka, JP;
Kazuaki Tatsumi, Osaka, JP;
Sharp Kabushiki Kaisha, Osaka, JP;
Abstract
A wiring board () of the present invention includes: a through hole (), provided in a semiconductor chip mounted region (), penetrating the wiring board (); and a groove pattern (), provided on a solder resist () formed on the semiconductor chip mounted region (), leading to the through hole (). The foregoing configuration makes it possible to guide, via the groove pattern () to the through hole (), moisture that collects in the semiconductor chip mounted region () and therefore to effectively discharge the moisture from the semiconductor chip mounted region (). Thus, a semiconductor device () that employs the wiring board () does not suffer from vaporization and expansion, inside of it, due to heat that is applied at the time of manufacturing the semiconductor device () and at the time of mounting the semiconductor device () on a mount substrate. It is therefore possible to reduce expansion of the semiconductor device.