The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2013
Filed:
Oct. 13, 2011
Applicants:
Scott D. Isebrand, Minneapolis, MN (US);
Nghia T. Dinh, Burnsville, MN (US);
Andrew S. Paule, Minneapolis, MN (US);
Ben P. Fok, Apple Valley, MN (US);
Inventors:
Scott D. Isebrand, Minneapolis, MN (US);
Nghia T. Dinh, Burnsville, MN (US);
Andrew S. Paule, Minneapolis, MN (US);
Ben P. Fok, Apple Valley, MN (US);
Assignee:
Rosemount Aerospace Inc., Burnsville, MI (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/14 (2006.01); H01L 23/02 (2006.01); H04R 21/02 (2006.01); H04R 25/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
An unattached, contained semiconductor device includes a semiconductor die, for example a MEMS pressure sensor die. The semiconductor die is unattached from the interior cavity of a surrounding containment body in that the semiconductor die is free of adherence to the containment body to mitigate packaging stress and strain between the containment body and the semiconductor die.