The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2013
Filed:
Mar. 22, 2011
Yoshihiro Ogawa, Yokkaichi, JP;
Shinsuke Kimura, Yokkaichi, JP;
Tatsuhiko Koide, Yokkaichi, JP;
Hisashi Okuchi, Yokohama, JP;
Hiroshi Tomita, Yokohama, JP;
Yoshihiro Ogawa, Yokkaichi, JP;
Shinsuke Kimura, Yokkaichi, JP;
Tatsuhiko Koide, Yokkaichi, JP;
Hisashi Okuchi, Yokohama, JP;
Hiroshi Tomita, Yokohama, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
In one embodiment, a method for treating a surface of a semiconductor substrate is disclosed. The semiconductor substrate has a first pattern covered by a resist and a second pattern not covered by the resist. The method includes supplying a resist-insoluble first chemical solution onto a semiconductor substrate to subject the second pattern to a chemical solution process. The method includes supplying a mixed liquid of a water repellency agent and a resist-soluble second chemical solution onto the semiconductor substrate after the supply of the first chemical solution, to form a water-repellent protective film on a surface of at least the second pattern and to release the resist. In addition, the method can rinse the semiconductor substrate using water after the formation of the water-repellent protective film, and dry the rinsed semiconductor substrate.