The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2013
Filed:
Oct. 25, 2011
Won Ho Jung, Namyangju-si, KR;
Hun Yong Park, Suwon-si, KR;
Jung Chul Kang, Seoul, KR;
Kyung Taeg Han, Hwaseong-si, KR;
Won Ho Jung, Namyangju-si, KR;
Hun Yong Park, Suwon-si, KR;
Jung Chul Kang, Seoul, KR;
Kyung Taeg Han, Hwaseong-si, KR;
Samsung Electronics Co., Ltd., Seoul, KR;
Abstract
A method for manufacturing a light emitting diode (LED) package is provided. The method includes preparing a package body including a first lead frame formed with a cavity and inserted on one side of a bottom surface of the cavity and a second lead frame inserted on the other side, mounting an LED chip on the bottom surface and electrically connecting the LED chip with the first lead frame and the second lead frame, forming a molding portion by a molding resin in the cavity, connecting, to the package body, a first mold corresponding to the molding portion and including a through hole having an inner surface linearly or non-linearly inclined, connecting a second mold to an upper surface of the first mold, forming a lens portion on the molding portion by a transparent resin, and separating the first mold and the second mold from the package body.