The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2013
Filed:
Aug. 25, 2008
Isamu Konishiike, Fukushima, JP;
Chisato Okina, Miyagi, JP;
Keisuke Tanabe, Miyagi, JP;
Atsuhiro Abe, Miyagi, JP;
Hidetoshi Nishiyama, Miyagi, JP;
Kenichi Kawase, Fukushima, JP;
Shunsuke Kurasawa, Fukushima, JP;
Koichi Matsumoto, Fukushima, JP;
Isamu Konishiike, Fukushima, JP;
Chisato Okina, Miyagi, JP;
Keisuke Tanabe, Miyagi, JP;
Atsuhiro Abe, Miyagi, JP;
Hidetoshi Nishiyama, Miyagi, JP;
Kenichi Kawase, Fukushima, JP;
Shunsuke Kurasawa, Fukushima, JP;
Koichi Matsumoto, Fukushima, JP;
Sony Corporation, Tokyo, JP;
Abstract
An evaporation apparatus that is capable of stably forming a good quality thin film and is highly suitable for mass production is provided. The evaporation apparatus include an evaporation source discharging an evaporation material by heating, a retention member retaining an evaporation object, and a heat shield member that is located between the evaporation source and the evaporation object retained by the retention member, has an opening for passing the evaporation material in a state of vapor phase from the evaporation source to the evaporation object, and shields the evaporation object from part of radiation heat of the evaporation source. The heat shield member is located closer to the evaporation source than to the retention member.