The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2013
Filed:
Dec. 30, 2005
William Bedingham, Woodbury, MN (US);
Chad J. Carter, Lake Elmo, MN (US);
Robert A. Harkins, Savage, MN (US);
Michael R. Harms, Mendota Heights, MN (US);
Christopher R. Kokaisel, St. Paul, MN (US);
Diane North, Inver Grove Heights, MN (US);
Kenneth B. Wood, Minneapolis, MN (US);
William Bedingham, Woodbury, MN (US);
Chad J. Carter, Lake Elmo, MN (US);
Robert A. Harkins, Savage, MN (US);
Michael R. Harms, Mendota Heights, MN (US);
Christopher R. Kokaisel, St. Paul, MN (US);
Diane North, Inver Grove Heights, MN (US);
Kenneth B. Wood, Minneapolis, MN (US);
3M Innovative Properties Company, St. Paul, MN (US);
Abstract
Methods and devices for thermal processing of multiple samples at the same time are disclosed. The sample processing devices provide process arrays that include conduits useful in distributing sample materials to a group of process chambers located in fluid communication with the main conduits. The sample processing devices may include one or more of the following features in various combinations: deformable seals, process chambers connected to the main conduit by feeder conduits exiting the main conduit at offset locations, U-shaped loading chambers, and a combination of melt bonded and adhesively bonded areas.