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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8435376 B1

PDFFull Text
Expired
Date of Patent:
May. 07, 2013

Filed:

May. 25, 2010

Carrier for manufacturing substrate and method of manufacturing substrate using the same

Applicants:

Jin Ho Kim, Gyunggi-do, KR;

Jin Yong Ahn, Gyunggi-do, KR;

Ki Hwan Kim, Gyunggi-do, KR;

Byung Moon Kim, Gyunggi-do, KR;

Seok Kyu Lee, Gyunggi-do, KR;

Inventors:

Jin Ho Kim, Gyunggi-do, KR;

Jin Yong Ahn, Gyunggi-do, KR;

Ki Hwan Kim, Gyunggi-do, KR;

Byung Moon Kim, Gyunggi-do, KR;

Seok Kyu Lee, Gyunggi-do, KR;

Assignee:

Samsung Electro-Mechanics Co., Ltd., Suwon, Gyunggi-do, KR;

Attorney:

Blakely Sokoloff Taylor & Zafman LLP

Primary Examiner:

Sing P Chan

Int. Cl.
CPC ...
B29C 65/02 (2006.01); B29C 65/52 (2006.01); B29C 63/26 (2006.01); B32B 37/26 (2006.01); B32B 38/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

Disclosed herein is a carrier for manufacturing a substrate, including: a base plate; adhesive layers formed on one side or both sides of the base plate; auxiliary adhesive layers, each of which is buried in one side of each of the adhesive layers, has a smaller area than each of the adhesive layers and has lower adhesivity than each of the adhesive layers; and metal layers, each of which is formed on one side of each of the auxiliary adhesive layers, whose edges are attached to the adhesive layers, and whose other portions excluding the edges are attached to the auxiliary adhesive layers. The carrier is advantageous in that a metal layer and an auxiliary adhesive layer are attached to each other by the adhesivity of the auxiliary adhesive layer, so that it is not required to use vacuum adsorption, with the result that a process of manufacturing a substrate can be performed more stably.

Find Patent Forward Citations

Kim, Jin. (2013). Carrier for manufacturing substrate and method of manufacturing substrate using the same (U.S. Patent No. 8435376). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8435376

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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