The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2013
Filed:
Oct. 07, 2009
Hans-juergen Hesse, Paderborn, DE;
Joerg Wallaschek, Paderborn, DE;
Michael Broekelmann, Delbrueck, DE;
Piotr Vasiljev, Vilnius, LT;
Hans-Juergen Hesse, Paderborn, DE;
Joerg Wallaschek, Paderborn, DE;
Michael Broekelmann, Delbrueck, DE;
Piotr Vasiljev, Vilnius, LT;
Hesse & Knipps GmbH, Paderborn, DE;
Abstract
A bonding device, particularly for producing bond connections between electrical conductors made of wire material or strip material and contact points of substrates such as electrical circuits, wherein the bonding device comprises a bonding head () which can be rotated about a geometric axis of rotation (D), in particular a vertical axis, and on which a bonding tool () and an ultrasonic transducer () are disposed for ultrasonic vibration excitation of the bonding tool (). It is proposed that the main direction of extension () of the ultrasonic transducer () and/or the direction of extension thereof in the direction of the axis of the minimum moment of inertia extends parallel to the geometric axis of rotation (D) of the bonding head (). The invention further relates to a bonding device or an ultrasonic transducer.