The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2013
Filed:
May. 25, 2011
Eric Vance Kline, Rochester, MN (US);
Michael Robert Rasmussen, Mazeppa, MN (US);
Arvind Kumar Sinha, Rochester, MN (US);
Eric Vance Kline, Rochester, MN (US);
Michael Robert Rasmussen, Mazeppa, MN (US);
Arvind Kumar Sinha, Rochester, MN (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An embodiment is directed to an IC mounting assembly that comprises an IC device having a first planar surface, wherein multiple electrically conductive first terminals are located at the first surface. The assembly further comprises an IC device mounting platform having a second planar surface in closely spaced relationship with the first surface, wherein multiple electrically conductive second terminals are located at the second surface, each second terminal corresponding to one of the first terminals. A solder element extends between each first terminal and its corresponding second terminal, and a constraining element is fixably joined to the second surface, wherein the constraining element has a CTE which is selectively less than the CTE of the mounting platform at the second surface. The constraining element is provided with a number of holes or apertures, and each hole is traversed by a solder element that extends between a first terminal and its corresponding second terminal.