The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2013
Filed:
Sep. 12, 2008
Applicant:
Hiroaki Tanaka, Nisshin, JP;
Inventor:
Hiroaki Tanaka, Nisshin, JP;
Assignee:
Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi-ken, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device () includes: a FLR () that is disposed on a semiconductor substrate so as to divide the semiconductor substrate into an inner region and an outer region; a first bonding pad (to) that is disposed in the inner region and is connected to an external circuit by a wire (to) whose one end is connected to the external circuit; and a second bonding pad (to) that is disposed in the outer region and on which the other end of the wire is bonded.