The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2013
Filed:
Oct. 01, 2009
Xianzhu Zhang, Pointe-Claire, CA;
Arthur Barlow, Four Marks, GB;
Jerry Deleon, San Fernando, PH;
Juergen Schliz, Niedernhausen, DE;
Xianzhu Zhang, Pointe-Claire, CA;
Arthur Barlow, Four Marks, GB;
Jerry Deleon, San Fernando, PH;
Juergen Schliz, Niedernhausen, DE;
Excelitas Canada, Inc., Vaudreuil-Dorion, CA;
Abstract
A laminate leadless carrier package comprising an optoelectronic chip, a substrate supporting the chip, the substrate comprising a plurality of conductive and dielectric layers; a wire bond coupled to the optoelectronic chip and a wire bond pad positioned on the top surface of the substrate; an encapsulation covering the optoelectronic chip, the wire bond, and at least a portion of the top surface of the substrate, wherein the encapsulation is a molding compound; and wherein the package is arranged to be mounted as a side-looker. A process for manufacturing laminate leadless carrier packages, comprising preparing a substrate; applying epoxy adhesive to a die attach pad; mounting an optoelectronic chip on the die attach pad; wire-bonding the optoelectronic chip; molding a molding compound to form an encapsulation covering the optoelectronic chip, a wire bond, and the top surface of the substrate; and dicing the substrate into individual packages.