The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2013
Filed:
Mar. 09, 2010
Wen-chung Chiang, Lujhu Township, TW;
Keng-chung Wu, Lujhu Township, TW;
Ying-chi Hsieh, Lujhu Township, TW;
Cheng-kang LU, Lujhu Township, TW;
Ming-huang Fu, Lujhu Township, TW;
Wen-Chung Chiang, Lujhu Township, TW;
Keng-Chung Wu, Lujhu Township, TW;
Ying-Chi Hsieh, Lujhu Township, TW;
Cheng-Kang Lu, Lujhu Township, TW;
Ming-Huang Fu, Lujhu Township, TW;
High Conduction Scientific Co. Ltd., Lujhu Township, Taoyuan, TW;
Abstract
A method for making a packaging device for an electronic element includes: preparing a ceramic frame body defined with a hollow space for receiving the electronic element therein; preparing a ceramic substrate having a copper layer formed thereon; etching the copper layer to form a predetermined copper pattern on an upper surface of the ceramic substrate; placing the ceramic frame body onto the upper surface of the ceramic substrate and in contact with the copper pattern; and heating the ceramic frame body and the ceramic substrate such that the copper pattern bonds the ceramic frame body to the ceramic substrate. A packaging device for an electronic element is also disclosed.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile