The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2013

Filed:

Nov. 28, 2008
Applicants:

Tadashi Nagasawa, Yasu, JP;

Katsura Hayashi, Yasu, JP;

Inventors:

Tadashi Nagasawa, Yasu, JP;

Katsura Hayashi, Yasu, JP;

Assignee:

Kyocera Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H01K 3/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

A circuit board () includes an insulation layer () where a via conductor () is embedded. The via conductor () includes: a first conductor portion () having an lower portion narrower than an upper portion; and a second conductor portion () which is formed immediately below the first conductor portion (), connected to the first conductor portion (), and has a maximum width greater than the upper end width of the first conductor portion (). The insulation layer () has a plurality of indentations (T, T) on the surface in contact with the via conductor (). Convex portions (T, T) of the via conductor are arranged in the indentations (T, T).


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