The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2013

Filed:

May. 25, 2011
Applicants:

Akira Kuwahara, Kyoto, JP;

Takehisa Hataita, Kyoto, JP;

Soutaro Kishida, Kyoto, JP;

Inventors:

Akira Kuwahara, Kyoto, JP;

Takehisa Hataita, Kyoto, JP;

Soutaro Kishida, Kyoto, JP;

Assignee:

Horiba STEC, Co., Ltd., Kyoto-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01L 9/12 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention is adapted to prevent a diaphragm from being deformed by a thermal stress caused by thermal expansion coefficients of a sensor main unit and a fixing member and includes a sensor main unit to which a fixed electrode is fixed, a diaphragm structure that forms a sealed space between the diaphragm structure and the sensor main unit and a fixing member that is jointed to the diaphragm structure in a manner of surrounding a pressure receiving part of the diaphragm structure so as to lead a fluid to the pressure receiving part, wherein the diaphragm structure includes a flat plane diaphragm main unit and first and second ring members each having a known thermal expansion coefficient that are respectively provided on both sides of a circumference of the diaphragm main unit.


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