The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2013
Filed:
Jul. 21, 2006
Douglas Clippinger Allan, Corning, NY (US);
Olus Naili Boratav, Ithaca, NY (US);
Andrey V. Filippov, Painted Post, NY (US);
Allan Mark Fredholm, Hericy, FR;
Leonard R. Kent, Killington, VT (US);
Lewis Kirk Klingensmith, Corning, NY (US);
Terry Jay Ott, Horseheads, NY (US);
Randy Lee Rhoads, Horseheads, NY (US);
Douglas Clippinger Allan, Corning, NY (US);
Olus Naili Boratav, Ithaca, NY (US);
Andrey V. Filippov, Painted Post, NY (US);
Allan Mark Fredholm, Hericy, FR;
Leonard R. Kent, Killington, VT (US);
Lewis Kirk Klingensmith, Corning, NY (US);
Terry Jay Ott, Horseheads, NY (US);
Randy Lee Rhoads, Horseheads, NY (US);
Corning Incorporated, Corning, NY (US);
Abstract
Methods of drawing glass sheet via a downdraw process are provided. In certain aspects, the methods utilize rapid cooling below the root () of the forming apparatus (). Such rapid cooling can, for example, facilitate the use of glass having a liquidus viscosity less than about 100,000 poise. In other aspects, the methods utilize slow cooling between the viscosities of 10poises and 10poises. Such slow cooling can facilitate the production of glass substrates which exhibit low levels of compaction. In further aspects, substrates are removed from the glass sheet at elevated temperatures which can facilitate increases in the production rates of downdraw machines. In still further aspects, rapid cooling below the root, slow cooling between the viscosities of 10poises and 10poises, and/or substrate removal at elevated temperatures are combined. Such combinations can facilitate economically effective utilization of downdraw equipment.