The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2013
Filed:
Sep. 10, 2010
Mitsutoshi Hasegawa, Yokohama, JP;
Mamo Matsumoto, Hiratsuka, JP;
Tomohiro Saito, Kouza-gun, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Abstract
It arranges a bonding material between a pair of base materials having different heat capacities and in which a difference between thermal expansion coefficients thereof is within 10×10/° C.; and bonds the pair of the base materials by the bonding material, by irradiating electromagnetic wave to the bonding material to melt and then harden it, wherein a thermal expansion coefficient at part of the bonding material facing one of the pair of the base materials of which the heat capacity is smaller is smaller than a thermal expansion coefficient at part of the bonding material facing the other of the pair of the base materials of which the heat capacity is larger by a difference within 10×10/° C., thereby bonding the base materials of which a difference of thermal expansion coefficients is relatively small, as preventing breakage and crack from occurring and further suppressing a degree of warp.