The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8429815 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 30, 2013

Filed:

Jun. 29, 2007
Applicants:

Naoki Matsuzaki, Yokohama, JP;

Kazuya Ishiwata, Yokosuka, JP;

Hiroaki Toshima, Tokyo, JP;

Inventors:

Naoki Matsuzaki, Yokohama, JP;

Kazuya Ishiwata, Yokosuka, JP;

Hiroaki Toshima, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/02 (2006.01); H05K 3/10 (2006.01); H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for manufacturing an electronic substrate structure comprising a substrate, a glass layer, and a conductive layer. This method may include the steps of arranging the glass layer on the substrate, arranging the conductive layer that includes a precious metal particle on the glass layer while directly contacting the glass layer, and heating the glass layer together with the conductive layer at a temperature that is lower than a softening point of the glass layer so that the particle is put into the glass layer. The particle has a diameter of not less than 1 μm and not more than 10 μm.


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