The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2013
Filed:
Dec. 09, 2010
Applicants:
Chris T. LI, Fremont, CA (US);
Christopher Paul Lander, Morgan Hill, CA (US);
Ximeng Yang, San Francisco, CA (US);
Amish Rajesh Babu, Sunnyvale, CA (US);
Shyeu-yang Wang, Sunnyvale, CA (US);
Inventors:
Chris T. Li, Fremont, CA (US);
Christopher Paul Lander, Morgan Hill, CA (US);
Ximeng Yang, San Francisco, CA (US);
Amish Rajesh Babu, Sunnyvale, CA (US);
Shyeu-Yang Wang, Sunnyvale, CA (US);
Assignee:
Amazon Technologies, Inc., Reno, NV (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/16 (2006.01);
U.S. Cl.
CPC ...
Abstract
One or more data signal interconnects arranged on a substrate of a dense array reduce overall size of a device incorporating the dense array, such as a touch sensor or display. The data signal interconnects on the substrate carry signals from printed circuits coupled to the array to a controller via interconnect tabs.