The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2013
Filed:
Jun. 30, 2010
Charles Allan Brown, San Jose, CA (US);
John Martin Burns, San Jose, CA (US);
Ricardo German Duque, Dublin, CA (US);
Clayton Paul Henderson, Morgan Hill, CA (US);
Charles E. Hignite, San Jose, CA (US);
Rocky Dikang Mai, San Mateo, CA (US);
Jr-yi Shen, Sunnyvale, CA (US);
Charles Allan Brown, San Jose, CA (US);
John Martin Burns, San Jose, CA (US);
Ricardo German Duque, Dublin, CA (US);
Clayton Paul Henderson, Morgan Hill, CA (US);
Charles E. Hignite, San Jose, CA (US);
Rocky Dikang Mai, San Mateo, CA (US);
Jr-Yi Shen, Sunnyvale, CA (US);
HGST Netherlands B.V., Amsterdam, NL;
Abstract
A particle-capturing device. The particle-capturing device includes a component having a surface that is configured to be disposed inside an enclosure, and is configured to make contact with an air-stream carrying particles within the enclosure. The component includes an electrostatic particle-capturing portion that includes a dielectric electrically insulating portion, and a plurality of charged portions. The charged portions are embedded in the dielectric electrically insulating portion, and are configured to generate an electrostatic field coupled with the surface that captures the particles from a flow of the air-stream and confines the particles at the surface. In addition, the component is configured to provide at least one additional function within the enclosure exclusive of capturing particles.