The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2013
Filed:
Jan. 14, 2010
Applicants:
Miwa Ichiryu, Osaka, JP;
Hiroyuki Uehara, Hyogo, JP;
Hidetoshi Nishimura, Osaka, JP;
Inventors:
Assignee:
Panasonic Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
A first wiring () has a bending portion (), a first wiring region () extending from the bending portion () in the X direction, and a second wiring region () extending from the bending portion () in the Y direction. A via () is formed under the wiring (). The via () is formed so as not to overlap with a region of the bending portion () in the first wiring region (). The length of the via () in the X direction (x) is longer than the length thereof in the Y direction (y) and both ends of the via () in the Y direction overlap with both ends of the first wiring region () in the Y direction.