The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2013
Filed:
May. 20, 2011
Taishi Sasaki, Tokyo, JP;
Tsuyoshi Takayama, Tokyo, JP;
Mikio Ishihara, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
Provided is a semiconductor device including a heat dissipating fin; an insulating sheet bonded to an upper surface of the heat dissipating fin, with a part of the upper surface being exposed; a heat spreader located on the insulating sheet; a power element located on the heat spreader; and a transfer molding resin located to cover a predetermined surface including the part of the upper surface of the heat dissipating fin, the insulating sheet, the heat spreader and the power element, wherein the upper surface of the heat dissipating fin has a protruding shape and/or recessed shape located so as to bind an edge of the insulating sheet.