The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2013
Filed:
Jul. 09, 2010
Applicant:
Tomas Moreno, Hollister, CA (US);
Inventor:
Tomas Moreno, Hollister, CA (US);
Assignee:
Fairchild Semiconductor Corporation, South Portland, ME (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/538 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor die package and method of making the package. The package may have four semiconductor dies with one or more internally connected switch nodes, and may form a dual output or phase synchronous buck converter. The package may have control leads at opposite sides of the package from each other. Furthermore, the package may contain high side semiconductor dies that are oriented perpendicular to low side semiconductor dies.