The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2013
Filed:
Nov. 16, 2009
Kazumasa Adachi, Sayama, JP;
Motoo Takada, Sayama, JP;
Kozo Ono, Sayama, JP;
Nihon Dempa Kogyo Co., Ltd., Tokyo, JP;
Abstract
To easily bond substrates even made of materials whose linear expansion coefficients are different from each other when manufacturing an optical component used by transmitting light through an inside thereof. Buffer layers made of an amorphous inorganic substance causing a brittle fracture are formed on bonding surfaces of a plurality of substrates having linear expansion coefficients different from one another, and the substrates to be bonded are stacked so that the buffer layers are faced to each other. Then, a heat treatment is performed for a stack, and thereby direct bonding via an atom is formed between the buffer layers.