The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2013

Filed:

Oct. 22, 2007
Applicants:

Hye Jin Kim, Daejeon, KR;

Sung Q Lee, Daejeon, KR;

Kang Ho Park, Daejeon, KR;

Jong Dae Kim, Daejeon, KR;

Inventors:

Hye Jin Kim, Daejeon, KR;

Sung Q Lee, Daejeon, KR;

Kang Ho Park, Daejeon, KR;

Jong Dae Kim, Daejeon, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04R 25/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A micromini condenser microphone having a flexure hinge-shaped upper diaphragm and a back plate, and a method of manufacturing the same are provided. The method includes the steps of: forming a lower silicon layer and a first insulating layer; forming an upper silicon layer to be used as a back plate on the first insulating layer; forming a plurality of sound holes by patterning the upper silicon layer; forming a second insulating layer on the upper silicon layer; forming a conductive layer on the upper silicon layer having the sound holes, and forming a passivation layer on the conductive layer; forming a sacrificial layer on the passivation layer; depositing a diaphragm on the sacrificial layer, and forming a plurality of air holes passing through the diaphragm; forming electrode pads on the passivation layer and a region of the diaphragm; and etching the sacrificial layer, the passivation layer, the conductive layer, the upper silicon layer, the first insulating layer and the lower silicon layer to form an air gap between the diaphragm and the upper silicon layer. Consequently, due to the flexible diaphragm, a manufacturing process using semiconductor MEMS technology may improve the sensitivity of the condenser microphone and reduce the size of the condenser microphone, thereby enabling integration into a portable terminal.


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