The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2013
Filed:
Mar. 11, 2011
Applicants:
Zhen-xing YE, Shenzhen, CN;
Xian-xiu Tang, Shenzhen, CN;
Inventors:
Zhen-Xing Ye, Shenzhen, CN;
Xian-Xiu Tang, Shenzhen, CN;
Assignees:
Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Shenzhen, CN;
Hon Hai Precision Industry Co., Ltd., New Taipei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract
A heat dissipation device is used to dissipate heat generated by a number of memory chips of a motherboard. The heat dissipation device includes a bracket attached to the motherboard and at one side of the memory chips, at least one fan, and at least one connection member attached to the corresponding fan. The fan is adjustably attached to the bracket by the connection member.