The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2013
Filed:
Nov. 10, 2009
Minill Kim, Cheonan-si, KR;
Kwang Yong Lee, Anyang-si, KR;
Jonggi Lee, Yongin-si, KR;
Ji-seok Hong, Seoul, KR;
Hyun Jeong Woo, Hwaseong-si, KR;
Minill Kim, Cheonan-si, KR;
Kwang Yong Lee, Anyang-si, KR;
Jonggi Lee, Yongin-si, KR;
Ji-Seok Hong, Seoul, KR;
Hyun jeong Woo, Hwaseong-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
An apparatus to package a semiconductor chip includes a coil configured to use induction heating to reflow a solder ball of the semiconductor chip. The coil includes a first body, a second body parallel to the first body, a third body extending from the first body to the second body. The first and second bodies are symmetrical with respect to a vertical plane disposed therebetween. The first and second bodies have inclined surfaces facing each other, and the inclined surfaces are distant from each other downward.