The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2013

Filed:

Mar. 01, 2006
Applicants:

Ichirou Ogura, Ichihara, JP;

Yoshiyuki Takahashi, Ichihara, JP;

Yutaka Sato, Chiba, JP;

Inventors:

Ichirou Ogura, Ichihara, JP;

Yoshiyuki Takahashi, Ichihara, JP;

Yutaka Sato, Chiba, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08F 283/00 (2006.01); C08L 61/00 (2006.01); C08L 61/06 (2006.01); B24D 3/28 (2006.01); C08G 8/04 (2006.01); C08G 14/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

The object of the present invention is to provide an epoxy resin composition capable of realizing low dielectric constant and low dielectric dissipation factor, which is suited for use as a latest current high-frequency type electronic component-related material, without deteriorating heat resistance during the curing reaction. A phenol resin, which has the respective structural units of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P) derived from phenols, an alkoxy group-containing condensed polycyclic aromatic hydrocarbon group (B) derived from methoxynaphthalene and a divalent hydrocarbon group (X) such as methylene and also has a structure represented by —P—B—X— wherein P, B and X are structural sites of these groups in a molecular structure, is used as a curing agent for the epoxy resin, or a phenol resin as an epoxy resin material.


Find Patent Forward Citations

Loading…