The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2013
Filed:
Aug. 24, 2011
Jhy-long Jeng, Junghe, TW;
Jeng-yu Tsai, Chiayi, TW;
Shur-fen Liu, Baoshan Township, TW;
Jinn-shing King, Hsinchu, TW;
Jhy-Long Jeng, Junghe, TW;
Jeng-Yu Tsai, Chiayi, TW;
Shur-Fen Liu, Baoshan Township, TW;
Jinn-Shing King, Hsinchu, TW;
Abstract
A thermally curable solder resist composition for a flexible printed circuit board is provided. The solder resist composition includes (a) 50-100 parts by weight of an epoxy resin, wherein the epoxy resin includes at least an aliphatic polyester modified epoxy resin having formula (I) or (II), in which, each of Rand R, independently, is a Csaturated or an unsaturated carbon chain, Ris ether, phenyl, a Cheterocyclic or Csaturated carbon chain, n is an integer of 1-10 and the aliphatic polyester modified epoxy resin had a molecular weight of 1000-5000; (b) 1-10 parts by weight of a curing agent; and (c) 1-10 parts by weight of a catalyst.