The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2013

Filed:

May. 23, 2011
Applicants:

Chang Ming Wu, New Taipei, TW;

Yi Nan Chen, Taipei, TW;

Hsien Wen Liu, Luzhu Township, TW;

Inventors:

Chang Ming Wu, New Taipei, TW;

Yi Nan Chen, Taipei, TW;

Hsien Wen Liu, Luzhu Township, TW;

Assignee:

Nanya Technology Corporation, Kueishan, Tao-Yuan Hsien, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention relates to a plasma etching method and apparatus for preparing high-aspect-ratio structures. The method includes the steps of placing the substrate into a plasma etching apparatus, wherein the plasma etching apparatus includes an upper electrode plate and a lower electrode plate; continuously supplying an upper source RF power and a DC power to the upper electrode plate; and discontinuously supplying a bias RF power to the lower electrode plate. When the bias RF power is switched to the off state, a large amount of secondary electrons pass through the bulk plasma and reach the substrate to neutralize the positive ions during the duration time of the off state (T).


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