The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2013
Filed:
Mar. 26, 2007
Igor Bol, Sherman Oaks, CA (US);
Igor Bol, Sherman Oaks, CA (US);
International Rectifier Corporation, El Segundo, CA (US);
Abstract
A process to thin semiconductor wafers to less than 50 microns employs a dissolvable photoresist or polyimide or other glue material to hold a thick carrier plate such as a perforated glass to the top surface of a thick processed wafer and to grind or otherwise remove the bulk of the wafer from its rear surface, leaving only the preprocessed top surface, which may include semiconductor device diffusions and electrodes. A thick metal such as copper or a more brittle copper alloy is then conductively secured to the ground back surface and the glue is dissolved and the carrier plate is removed. The wafer is then cleaned and diced into plural devices such as MOSFETs; integrated circuits and the like.