The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2013
Filed:
Feb. 16, 2011
Motoaki Tani, Kawasaki, JP;
Shinya Iijima, Kawasaki, JP;
Shinichi Sugiura, Kobe, JP;
Hiromichi Watanabe, Kobe, JP;
Motoaki Tani, Kawasaki, JP;
Shinya Iijima, Kawasaki, JP;
Shinichi Sugiura, Kobe, JP;
Hiromichi Watanabe, Kobe, JP;
Fujitsu Limited, Kawasaki, JP;
Fujitsu Ten Limited, Kobe-shi, JP;
Abstract
A semiconductor device includes a first bump that is located over a surface of a semiconductor element, and is formed on a first bump formation face distanced from a back surface of the semiconductor element at a first distance, and a second bump that is located over the surface of the semiconductor element, and is formed on a second bump formation face distanced from the back surface of the semiconductor element at a second distance being longer than the first distance, the second bump having a diameter larger than a diameter of the first bump.