The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2013
Filed:
Oct. 09, 2003
Toshihide Sekido, Otsu, JP;
Kazuaki Kitaoka, Ehime, JP;
Hiroshi Odani, Ehime, JP;
Shigeru Nishiyama, Nagoya, JP;
Masahiko Shimizu, Nagoya, JP;
Toshihide Sekido, Otsu, JP;
Kazuaki Kitaoka, Ehime, JP;
Hiroshi Odani, Ehime, JP;
Shigeru Nishiyama, Nagoya, JP;
Masahiko Shimizu, Nagoya, JP;
Toray Industries, Inc., , JP;
Abstract
A method of RTM molding wherein a reinforcing fiber substrate is placed in a mold, each of a first and a second resin distribution media exhibiting a resin flow resistance lower than the resistance of the reinforcing fiber substrate is placed on each surface of the reinforcing fiber substrate, and the inside of the mold is evacuated and a resin is injected into the mold to thereby impregnate the reinforcing fiber substrate with the resin injected, characterized in that the first resin distribution medium exhibits a resin flow resistance lower than that of the second resin distribution medium, and the evacuation is carried out through the second resin distribution medium while the resin is injected through the first resin distribution medium. The method can be advantageously employed for producing, in particular, FRP structure which is thick and excellent in designability, lightweight property and/or strength.