The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2013

Filed:

Sep. 21, 2009
Applicants:

Ikuo Yoneda, Yokohama, JP;

Kentaro Matsunaga, Kawasaki, JP;

Yukiko Kikuchi, Fujisawa, JP;

Yoshihisa Kawamura, Yokohama, JP;

Eishi Shiobara, Yokohama, JP;

Shinichi Ito, Yokohama, JP;

Tetsuro Nakasugi, Yokohama, JP;

Hirokazu Kato, Kariya, JP;

Inventors:

Ikuo Yoneda, Yokohama, JP;

Kentaro Matsunaga, Kawasaki, JP;

Yukiko Kikuchi, Fujisawa, JP;

Yoshihisa Kawamura, Yokohama, JP;

Eishi Shiobara, Yokohama, JP;

Shinichi Ito, Yokohama, JP;

Tetsuro Nakasugi, Yokohama, JP;

Hirokazu Kato, Kariya, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B28B 11/08 (2006.01); B29C 35/08 (2006.01);
U.S. Cl.
CPC ...
Abstract

An imprint method includes applying a light curable resin on a substrate to be processed, the substrate including first and second regions on which the light curable resin is applied, contacting an imprint mold with the light curable resin, curing the light curable resin by irradiating the light curable resin with light passing through the imprint mold, generating gas by performing a predetermined process to the light curable resin applied on a region of the substrate, the region including at least the first region, wherein an amount of gas generated from the light curable resin applied on the first region is larger than an amount of gas generated from the light curable resin of the second region, and forming a pattern by separating the imprint mold from the light curable resin after the gas being generated.


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