The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2013
Filed:
Jun. 10, 2009
Yezdi Dordi, Palo Alto, CA (US);
Bob Maraschin, Cupertino, CA (US);
John Boyd, Atascadero, CA (US);
Fred C. Redeker, Fremont, CA (US);
Yezdi Dordi, Palo Alto, CA (US);
Bob Maraschin, Cupertino, CA (US);
John Boyd, Atascadero, CA (US);
Fred C. Redeker, Fremont, CA (US);
Lam Research Corporation, Fremont, CA (US);
Abstract
An electroplating head is disposed above and proximate to an upper surface of a wafer. Cations are transferred from an anode to an electroplating solution within the electroplating head. The electroplating solution flows downward through a porous electrically resistive material at an exit of the electroplating head to be disposed on the upper surface of the wafer. An electric current is established between the anode and the upper surface of the wafer through the electroplating solution. The electric current is uniformly distributed by the porous electrically resistive material present between the anode and the upper surface of the wafer. The electric current causes the cations to be attracted to the upper surface of the wafer.