The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2013
Filed:
Jun. 11, 2010
Yasuyuki Sekimoto, Ritto, JP;
Yasuyuki Sekimoto, Ritto, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
A method for manufacturing a multilayer wiring substrate processes a via hole without unnecessarily increasing the diameter thereof and which can easily achieve the formation of fine wiring. A first resin layer in a cured state is prepared in which at least one first via hole including a bottom made of a conductive pattern is formed by laser processing, a second resin layer in an uncured state is prepared in which at least one second via hole is formed to penetrate therethrough at a position corresponding to the first via hole, and the first resin layer and the second resin layer are laminated to each other so that the first via hole and the second via hole communicate with each other. After a conductive paste is simultaneously filled in the first via hole and the second via hole, a metal foil is pressure-bonded to the second resin layer, and the second resin layer and the conductive paste are simultaneously cured. Subsequently, the metal foil is patterned.