The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2013

Filed:

Aug. 30, 2010
Applicants:

Overton L. Parish, Iv, Lubbock, TX (US);

Roger S. Devilbiss, Dallas, TX (US);

Inventors:

Overton L. Parish, IV, Lubbock, TX (US);

Roger S. DeVilbiss, Dallas, TX (US);

Assignee:

ThermoTek, Inc., Flower Mound, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F25B 21/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A cooling apparatus for removing heat having a low profile unitary member. The low profile unitary member has an evaporator portion and a condenser portion. The evaporator portion is thermally exposed to a heat generating component. The condenser portion is disposed at an elevated angle with respect to the evaporator portion. A plurality of microtubes are disposed within the first low profile extrusion. The plurality of microtubes have a heat transfer fluid contained therein. A second plurality of low profile extrusion members are mounted as fins on the evaporator section of the low profile unitary member. Heat is transferred from the heat generating component to the heat transfer fluid contained with the microtubes located within the evaporator portion. The heat transfer fluid to which the heat was transferred migrates to the condenser portion of the low profile unitary member by way of the microtubes. The heat transfer fluid is cooled in the condenser portion of the low profile unitary member. Cooling of the heat transfer fluid within the condenser section is enhanced by the second plurality of low profile extrusion members. The heat transfer fluid is returned to the evaporator section after cooling.


Find Patent Forward Citations

Loading…