The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2013
Filed:
Feb. 02, 2009
Ryohei Satoh, Osaka, JP;
Koji Nakagawa, Tokyo, JP;
Eiji Morinaga, Osaka, JP;
Reo Usui, Osaka, JP;
Kenji Tanaka, Tokyo, JP;
Satoru Takaki, Tokyo, JP;
Kenichi Ebata, Tokyo, JP;
Hiroshi Sakamoto, Tokyo, JP;
Ryohei Satoh, Osaka, JP;
Koji Nakagawa, Tokyo, JP;
Eiji Morinaga, Osaka, JP;
Reo Usui, Osaka, JP;
Kenji Tanaka, Tokyo, JP;
Satoru Takaki, Tokyo, JP;
Kenichi Ebata, Tokyo, JP;
Hiroshi Sakamoto, Tokyo, JP;
Asahi Glass Company, Limited, Tokyo, JP;
Abstract
A method for manufacturing a circuit pattern-provided substrate including forming a resist layer on a substrate, forming an opening corresponding to a circuit pattern and having an eaves cross-sectional shape in the resist layer, forming a thin film layer having a portion formed on the substrate in the opening and a portion formed on the resist layer, and removing the resist layer such that the resist layer and the portion of the thin film layer formed on the resist layer are removed from the substrate. The forming of the opening comprises exposing the resist layer with a mask device which changes an exposure amount of the resist layer such that the eaves cross-sectional shape has a space at a boundary between the resist layer and the substrate.