The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2013
Filed:
Jun. 23, 2008
Kwang Soo Park, Busan, KR;
Myung Gun Chong, Gyeongsangnam-do, KR;
Dek Gin Yang, Chungcheongbuk-do, KR;
Dae Jung Byun, Busan, KR;
Kwang Soo Park, Busan, KR;
Myung Gun Chong, Gyeongsangnam-do, KR;
Dek Gin Yang, Chungcheongbuk-do, KR;
Dae Jung Byun, Busan, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Abstract
The present invention relates to an embedded printed circuit board and a manufacturing method thereof. The present invention provides an embedded printed circuit board including a substrate in which a cavity is formed in a predetermined portion and a wiring layer is formed in a portion without the cavity; a chip inserted into the cavity and including a plurality of pads; a filler filled between the chip and the cavity to fix the chip; and a connection layer formed between the wiring layer and the pads to connect the wiring layer and the pads to each other. Further, the present invention provides a manufacturing method of the embedded printed circuit board.