The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2013
Filed:
Oct. 25, 2011
Keiji Fukumura, Osaka, JP;
Hironobu Agari, Osaka, JP;
Kazuhiko Suzuki, Saitama, JP;
Hideki Agari, Tokyo, JP;
Keiji Fukumura, Osaka, JP;
Hironobu Agari, Osaka, JP;
Kazuhiko Suzuki, Saitama, JP;
Hideki Agari, Tokyo, JP;
Ricoh Company, Ltd., Tokyo, JP;
Abstract
A semiconductor package includes an IC chip including a pad array having at least four pads, the pads including a voltage input pad and a voltage output pad disposed at edges of the pad array, a driver transistor disposed between the voltage input pad and the voltage output pad to receive an input voltage from the voltage input pad and output an output voltage to the voltage output pad, disposed in contact with an outer edge of the element arrangement region; and at least four leads on which the IC chip is mounted by flip chip bonding, disposed corresponding to the pads, formed in a lead array, the leads including a voltage input lead electrically connected to the voltage input pad and a voltage output lead electrically connected to the voltage output pad, disposed at edges of the lead array.