The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2013
Filed:
Jun. 04, 2010
Masami Ogura, Tochigi, JP;
Takahito Takayanagi, Tochigi, JP;
Yuko Yamada, Tochigi, JP;
Jun Kato, Tochigi, JP;
Tsugio Masuda, Tochigi, JP;
Tsukasa Aiba, Tochigi, JP;
Fumitomo Takano, Tochigi, JP;
Masami Ogura, Tochigi, JP;
Takahito Takayanagi, Tochigi, JP;
Yuko Yamada, Tochigi, JP;
Jun Kato, Tochigi, JP;
Tsugio Masuda, Tochigi, JP;
Tsukasa Aiba, Tochigi, JP;
Fumitomo Takano, Tochigi, JP;
Honda Motor Co., Ltd., Tokyo, JP;
Abstract
There is provided a semiconductor device including: a circuit board formed by bonding a first and a second metal plates to both surfaces of an insulating substrate respectively, at least one semiconductor element to be bonded to an external surface of the first metal plate through a first solder, and a radiating base plate to be bonded to an external surface of the second metal plate through a second solder, wherein the first and the second solders are constituted by solder materials of the same type, and a ratio of a sum of thicknesses of the first and the second metal plates to a thickness of the insulating substrate is set in a predetermined range to ensure an endurance to a temperature stress of each of the first and the second solders.