The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2013
Filed:
Feb. 04, 2010
Brian D. Sawyer, Palo Alto, CA (US);
Thomas Scott Morris, Lewisville, NC (US);
Milind Shah, San Diego, CA (US);
Brian D. Sawyer, Palo Alto, CA (US);
Thomas Scott Morris, Lewisville, NC (US);
Milind Shah, San Diego, CA (US);
RF Micro Devices, Inc., Greensboro, NC (US);
Abstract
The present invention relates to a multi-layer laminate or substrate manufacturing process for forming soldering surfaces on a substrate of a module without requiring a solder mask. In one embodiment, a substrate is provided having a substrate body, soldering pads, and a metal segment. A patterned mask is formed over the substrate such that soldering surfaces of the soldering pads remain exposed. The soldering surfaces of the soldering pads are plated to create plated soldering surfaces over the soldering pads. The plated soldering surfaces are the regions for solder placement. The patterned mask is then removed from the substrate. Next, an anti-wetting treatment is applied to the substrate such that any unplated metal surfaces react to the anti-wetting treatment to form treated surfaces. As such, the plated soldering surfaces will wet solder while the treated surface will not wet solder. In a preferred embodiment, the anti-wetting treatment is an oxidation process.